AP 路由器芯片

WISEN-4 AX3000/BE3600

2.4GHz/5Ghz Wi-Fi 6 AP-Router Solution

WISEN-4 是一款高度集成的系统级芯片（SoC），专为高性能无线网络路由器设计，目标应用包括家庭无线连接和商用 AP 路由器等。
该芯片采用先进的硅工艺制造，集成了双核 Arm® Cortex-A53 MPCore™ 处理器，主频高达 1.6 GHz，并具备增强的 DRAM 带宽。SoC 提供丰富的外设接口，包括 SGMII 和 USB 3.0 主机端口。为满足现代网络需求，它还支持两个 2.5Gbps HSGMII 以太网接口。WISEN-4 构成了适用于 Wi-Fi 6 AX3000 / Wi-Fi 7 BE3600 无线路由平台的完整双频并发芯片组解决方案。

除了核心网络连接功能外，WISEN-4 还通过硬件级 NAT 引擎和内建服务质量（QoS）机制提升家庭娱乐体验。该引擎可优先处理音视频等对时延敏感的流量，相较于普通数据流量具有更高优先级。

凭借其先进的技术与全面的功能特性，WISEN-4 是下一代智能 Wi-Fi 接入点路由器与家庭网关系统的理想核心平台。

WLAN

  • IEEE 802.11 b/g/n/ac/ax compliant
  • Dual-band (2.4GHz 5GHz) MIMO RF, 20/40/80/160MHz bandwidth
  • 2.4G support 20/40MHz. bandwidth auto adaption or fixed bandwidth
  • 5G support 20/40/80/160MHz bandwidth auto adaption or fixed bandwidth
  • Support TWT
  • Security support for WFA WPA2/WPA3
  • Support 802.11n MCS0 to MCS15 BW20/40
  • Support 802.11ac MCS0 to MCS9 BW20/40/80/160 MHz with Nss = 1~2
  • Support 802.11ax MCS0 to MCS11 BW20/40/80/160 MHz with Nss = 1~2
  • A-MPDU/A-MSDU
  • Beamformer(explicit/implicit)
  • Supports 802.11w protected managed frame
  • Fragmentation and defragmentation
  • Support Dual band Dual Concurrent
  • Support Short Guard Interval for 802.11n and 802.11ac
  • Support RX Space-Time Block Code (STBC)
  • Support Low Density Parity Check (LDPC) code
  • Support Dual Carrier Modulation (DCM)
  • Support digital pre-distortion to enhance PA performance
  • Radar detection
  • UL/DL MU-MIMO w/o OFDMA support
  • UL/DL OFDMA users: 2.4G/4, 5G/8
  • Support total 256 users
  • Integrated LNA, PA and T/R switch

Application Processor MCU & Memory

  • Dual-core Arm® Cortex-A53 MPCoreTM operating at 1.6 GHz
  • NEON processing engine with advanced SIMD and floating-point extension
  • 32KB L1 I-cache and 32KB L1 D-cache
  • 256KB unified L2 cache
  • Cryptography extension
  • 16-bit data bus width
  • Memory clock up to DDR4-3200/DDR3-2133
  • QoS supported

Security

  • Hardware accelerator for SKE/PKE/HASH
  • Support TRNG
  • Support Trustzone
  • Support Secure boot
  • 16Kb OTP (4Kb for functional)

Peripheral Interfaces

  • 0 (host) x1
  • 0(host)/PCIe Gen3 1-Lane interface/HSGMII x1
  • HSGMII (5Gbps) x1
  • MDC/MDIO x2
  • UART for external devices and debugging interfaces x2
  • SPI master for external devices x3
  • 5/SD interface x1
  • I2C to control peripheral devices x2
  • General-Purpose Input/Output x60
  • PWM (Pulse Width Modulation) x2 (4 channel)

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